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Semiconductors are the brains of the modern era, and the US semiconductor industry will soon become the number one contributor to job creation in our country. The semiconductor market is essential and ubiquitous in daily life. The demand for more powerful and economical devices that rely on the semiconductor market is growing exponentially, such as laptops, mobile phones, virtual and augmented reality devices, televisions, electric vehicles, airplanes, military equipment, healthcare equipment, and spacecraft And instruments, Internet of Things (IoT), communication and sensing equipment, ultra-high-speed data transmission and monitoring equipment.

Therefore, the global semiconductor market is expected to reach 730 billion U.S. dollars, and the semiconductor manufacturing equipment market is expected to exceed 95.9 billion U.S. dollars by 2025. Today's mobile phone has more computing power than the computer NASA used when it landed in 1969. A person on the surface of the moon.

As demand increases, innovative solutions are also needed to meet the challenges faced by the semiconductor manufacturing industry.

Companies dedicated to providing manufacturers with efficient and advanced solutions must keep up with increasing demand, especially in an increasingly electronic world. In this interview, we will discuss the need for advanced solutions to semiconductor manufacturing challenges, and how Hardinge Inc. solves various semiconductor manufacturing applications through innovative products.

In order to produce electronic devices, manufacturers need large amounts of solid-state memory (DRAM), MOSFET, 3-D NAND flash memory, DSP, MPU, MCU, display LCD, and organic light-emitting diode (OLED).

There are more and more new wafer fabrications to support this growing demand. In turn, wafer fabrication equipment manufacturers are facing unexpected demands for machines and components.

Wafer production involves various manufacturing operations, including the outer diameter of the ingot (ingot), notch and plane grinding, cutting the ingot, edge grinding, surface grinding, polishing and back grinding, patterning, CMP, etching, deposition, light Engraving, ion implantation, inspection, cutting, cutting and packaging.

Many of these processes are carried out under high vacuum, with corrosive chemicals, highly corrosive gases and plasmas, high temperature and high pressure. Therefore, wafer manufacturing requires advanced materials that can operate under these conditions, including stainless steel, anodized aluminum, high-temperature polymers, and most importantly advanced ceramics.

Whether in the manufacture, use or application of advanced semiconductors, advanced ceramics play a vital role in promoting these developments.

Various precision-machined ceramic components are essential in the wafer manufacturing process, such as silicon electrodes, wafer polishing substrates, electrostatic chucks, carriers, rings, domes, heaters, anti-plasma components, nozzles, windows, and feeders. Pass insulator.

Typical steps for producing advanced ceramic parts include green manufacturing (CNC turning and milling), sintering, and then CNC grinding. In addition, with the development of larger-sized silicon and silicon carbide wafers, correspondingly new and larger components such as heaters, carriers, and chucks are required.

However, in terms of manufacturing and processing, manufacturing advanced ceramics with high tolerances is challenging. In order to overcome this problem, precision machine tools need to be developed.

In addition, the manufacture of ceramics is inherently slower than the manufacture of plastics or metals that are easy to process. Therefore, a faster solution is needed to shorten the lead time, which usually takes 8-20 weeks.

Hardinge is the world's leading supplier of advanced, high-precision CNC machine tool solutions and aftermarket tools and accessories.

With more than 130 years of experience, the company has always been a leader in innovation, with a full range of CNC lathes, milling and grinders, and workpiece clamping products, providing customers and partners in more than 50 countries around the world with smart solutions to meet the needs of the world The most demanding requirements on manufacturing requirements.

Our CNC machine tools provide proven technology to handle the most challenging materials and most complex machining geometries in the world. We have extensive knowledge in manufacturing multi-task CNC grinders and components for grinding, milling and drilling, such as ingots, wafers, silicon electrodes, rings, chucks and domes made of advanced ceramic materials.

These materials include single crystal or polycrystalline silicon (Si), aluminum oxide (Al2 3O), aluminum nitride (AlN), silicon nitride (Si 3 4N), silicon carbide (SiC), quartz glass (SiO2), GaN and ferrite body.

Hardinge has a professional team focused on processing ingots and wafers used in semiconductor processing machines and innovative solutions for advanced ceramics. The team provides customers with the most advanced multi-tasking CNC grinders and CNC precision lathes, reducing cycle time by up to 70%, reducing waste by 45%, machine uptime by more than 95%, reducing the number of operators, and footprints.

In order to succeed in the semiconductor market, Hardinge has integrated the latest CNC control, measurement, machinery and processing technologies into one platform.

By adding functionality, Hardinge can develop automated processes in a single setting, combining different types of grinding. This enables customers to achieve higher productivity, surface finish and consistent part quality when using the most demanding materials.

In order to support the latest manufacturing trends, Hardinge's solutions integrate smart technology and smart monitoring systems, and are ideal for the Internet of Things and Industry 4.0. Manufacturers can expect to simplify the production process when using these platforms, thereby increasing the efficiency and productivity of advanced ceramic processing in the semiconductor industry.

Hardinge provides a high-resolution vision system for complex automatic part orientation, focusing on creating new part centerlines based on existing part features, and allowing eccentric machining processes to achieve concentricity based on the new centerlines found.

We also provide laser measurement technology for all grinding wheels in the tool changer and large outer diameter grinding wheels with automatic offset function to compensate for the wear of diamond dressing wheels. In addition, the next generation of high-speed, high-precision lasers are very effective for rapid part setup and process control.

Hardinge provides high-resolution detection, measurement and feedback systems for automated processing to measure key part characteristics in the cycle, including automatic size correction.

We help customers achieve process control through closed-loop feedback, using probe data to directly update machine tool control offsets in a repeatable and reliable manner, and to compensate for common causes of process instability.

Probing is the best way to maximize the efficiency, quality, capability and accuracy of the manufacturing process. The standard procedures in our modern CNC control simplifies the integration of probing cycles into machining operations and offline tools. These programs are combined with the CAD interface to easily simulate measurement functions.

Our fully integrated 5-axis control architecture can achieve all grinding operations at the best peripheral approach angle, including the ability to use a straight grinding wheel to generate a radius, thereby achieving a higher surface finish on the entire part.

Our industry-leading static pressure B/B1 axis rotation technology can be applied to the work head and the grinding wheel head side to increase machine flexibility, and is designed to support a fully integrated 5-axis control architecture to achieve all under optimal grinding conditions operate.

We also provide multi-spindle technology on the same machine platform. This industry-leading solution allows users to choose powerful low-speed spindles that are ideal for outer diameter/face grinding operations with larger grinding wheels, while supporting high-speed spindles to optimize processing of smaller features without compromising performance .

Our automatic tool change spindle speeds up to 30,000 rpm, mounted on the vertical Y axis, to complete the eccentric feature in a very effective way. For ATC spindles, we provide an integrated 20-position tool changer. We also provide flexible grinding wheel dressing, with a rotating dresser connected to the head shaft.

Finally, machine diagnostics, machine performance measurement, and preventive maintenance are critical to establishing a known and repeatable level of process capability. Our laser interferometers and ball bar measurement systems evaluate, monitor and improve the static and dynamic performance of our CNC machine tools.

Hardinge has built many CNC lathes, CNC vertical machining centers and CNC grinders, which have been running 24/7 in the semiconductor industry in different regions of the country. The current demand is to develop CNC machines with multitasking capabilities to produce semiconductor parts in a single setup, thereby shortening production time and reducing waste.

Hardinge's main goal is to become the number one CNC machine tool supplier in the advanced ceramic manufacturing market. We are also committed to developing, designing and manufacturing the most advanced American manufacturing machines, bringing them to the market and developing new processing technologies that can handle the world's most challenging materials and most complex processing geometries.

Dr. Osman Boydas has more than 35 years of sales and service experience in the CNC machine tool business, including practical experience in the design and production of parts in the semiconductor, aerospace, defense, energy, and medical industries. He holds a PhD in engineering from the Massachusetts Institute of Technology and WPI, as well as a European patent for a fully automatic welding machine. In addition, he has written books and articles on grinding and metal cutting.

This information is derived from materials provided by Hardinge Inc. and has been reviewed and adapted.

For more information on this source, please visit Hardinge Inc.

Disclaimer: The views expressed here are those of the interviewees and do not necessarily represent the views of the owner and operator of this website AZoM.com Limited (T/A) AZoNetwork. This disclaimer forms part of the terms and conditions of use of this website.

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